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Kaynes Technology Stock Up by 1%

By Ankur Chandra | Published at: Aug 5, 2025 02:56 PM IST

Kaynes Technology Stock Up by 1%
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Bengaluru, August 5, 2025 – Kaynes Technology India Ltd (NSE: KAYNES) shares rose over 2% in early trading on August 5, 2025. This, after its subsidiary signed a Memorandum of Understanding (MoU) with the Tamil Nadu government for investing Rs 4,995 crore in the state. The move aims to expand its manufacturing, supporting vertical integration.

At 1:50, Indian Standard Time today, the stock price is up by 1% at Rs 6,360.

Key Details

Kaynes Circuits India Private Limited, a wholly owned subsidiary of Kaynes Technology has signed a non-binding MoU with the Government of Tamil Nadu. As per the MoU, the company proposes to invest approximately ₹4,995 crore in the state over the next six years, expanding its electronic manufacturing infrastructure and capabilities and aligning with the ‘Make in India’ initiative.

Stock Performance Snapshot

As of 1:08 PM IST on August 5, 2025, the stock traded at ₹6,349.00, up ₹52.00 or 0.83% from the previous close of ₹6,297.00. It touched an intraday high of ₹6,515.00 and a low of ₹6,340.00. The adjusted P/E stood at 132.80, with a market cap of ₹42,504.36 crore.

Company Background

Kaynes Technology India Limited is a public, integrated electronics manufacturer headquartered in Mysuru. It delivers end-to-end and IoT-enabled Electronics System and Design Manufacturing (ESDM) services, ranging from conceptual design and process engineering to PCBA, box build, ODM and life‑cycle support across sectors like automotive, aerospace, railways, industrial, medical and space. It operates eight certified manufacturing plants across India.

Kaynes Circuits India Private Limited

Kaynes Circuits India Private Limited is a fully owned subsidiary of Kaynes Technology India. It focuses on electronic component manufacturing and is set to establish a ₹4,995 crore facility in Thoothukudi, Tamil Nadu. The plant will produce advanced components including 74‑layer PCBs, HDI and flexible PCBs, high-performance laminates, camera module assemblies, and wire-harness systems.

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